Wafer Size 76mm, 100mm, 125mm, 150mm, 200mm, 300mm
Copper and Non Copper Reclaim
Processes Strip & Etch, Laser Scribe, Polish, Sort, Clean, Particle Scanning, Packaging
Particle <50 @ > 0.12µm on 200mm
<50 @ > 0.12µm on 300mm
Metals < 1E10 / atoms cm2, measured by on-site Agilent 7500cs ICP-MS

Detection limit down to 1 ppt
Detected metals list:
Al, Ca, Cr, Co, Cu, Fe, Pb, Li, Mn, Mg, Ni, K, Ag, Na, Th, Zn
Other metals available upon request.